| 2. | On the base of the development of thick film pastes technology , ru - based thick film resistor pastes have been studied due to select conductive phase and inorganic binder . state - of - the - art techniques such as rolling , screen printing and sintering were used for sample preparation . effects of ingredients , printing parameters and sintering parameters , microstructure on the properties of thick film resistor ( trf ) have been analyzed with xrd , sem , dsc and electrical tests
本文在跟踪国内外厚膜浆料技术发展的基础上,以钌酸铋/银系厚膜电阻浆料为研究对象,通过选用合适的功能相和无机粘结相成分,以三辊轧制、丝网印刷和高温烧结等制备工艺为技术特征,采用xrd 、 sem 、 dsc等分析方法和电性能测试手段,系统的研究了浆料中各相的成分配比、制备工艺参数,以及膜层微观结构对厚膜电阻性能的影响规律。 |
